Kontron – Ultra


NEU:
Ineltro ist Member der nanoETXexpress.org !!!

Partner für Systeme, Produkte, Design

nanoETXexpress-SP-512MB        
512MB SDRAM, 512MB Flash, 1.1GHz
COM Express™ compatible module size nano (55mm x 84mm)
Based on COM Express™ Pin-out Type 1
Kontron Nr. 34001-5151-11-1

nanoETXexpress-SP-1/4GB     
1GB SDRAM, 4GB Flash, 1.6GHz
Kontron Nr. 34001-1040-16-1


Details

nanoETXexpress-TT


COM Express® kompatibles Type 10 SFF Computer-on-Module
mit Intel® Atom™ Prozessor E6xx 

- Enwickelt für den industriellen Temperaturbereich von -40°C bis +85°C (E2)
- Varianten für den kommerziellen Temperaturbereich von 0°C bis +60°C
- Intel® Atom™ Prozessor E6XX - bis zu 1,6 GHz
- 55mm x 84mm

Kontron – Compact 

microETXexpress®-DC

- Intel® Atom™ N270 1.6GHz processor in 45 nm with Hyperthreading
- Only 95 x 95 mm, COM Express™ compatible
- Fanless use
- Economic Power-Off S5 Eco
- Kontron Nr. 36005-0000-16-2

Details

microETXexpress®-SP

- Only 95 x 95 mm, COM Express™ compatible
- Intel® Atom™ Z5xx series up to 1.6 GHz and Intel® System Controller Hub US15W
- Up to 1 GByte DDR2 memory
- USB Client, PCI Express, PCI, SATA

microETXexpress®-SP-11:  36003-0000-11-1  
with 1.1GHz Intel® Atom™ processor

microETXexpress®-SP-16:  36003-0000-16-1  
with 1.6GHz Intel® Atom™ processor

Details

microETXexpress®-XL

- Based on the Intel® Atom™ processor Z520PT and
- US15WPT System Controller Hub
- Onboard system memory and SSD (option) for extreme reliability
- Completely designed for -40 to +85°C operation

microETXexpress®-XL    36006-1000-13-1
Z520PT (1.33GHz) 1GB DDR2 SDRAM

microETXexpress®-XL    36006-2000-13-1
Z520PT (1.33GHz) 2GB DDR2 SDRAM

microETXexpress®-XL HSP, threaded     36006-0000-99-0
Heatspreader for microETXexpress®-XL, threaded stand-off

microETXexpress®-XL HSK, passive        36006-0000-99-0C02
Passive Heatsink for microETXexpress®-XL without fan

Details

microETXexpress®-PC

- Intel® GS45 and DDR3 memory
- Up to Intel® Core™2 Duo with energy-saving 45nm
- Only 95 x 95 mm, COM Express™ compatible
- Highest performance with ultra low voltage
- Intel® ICH9M SFF and 8x USB 2.0

microETXexpress®-PC  L9400:    36004-0000-19-2
microETXexpress®-PC  SU9300: 36004-0000-12-2
microETXexpress®-PC  722:        36004-0000-12-1
microETXexpress®-PC  723:        36004-0000-12-3

Details

microETXexpress-PV

- Compact COM Express module featuring 2nd Generation Atom Technology
- First dual Core Intel® Atom™ COM - up to Intel® Atom™ D510 processor (2x 1.66GHz)
- Support for up to 4GB DDR2 system memory
- Native LVDS and VGA simultaneous graphics support

microETXexpress®-PV D510   36007-0000-16-2  
Intel® Atom™ D510 (1 MB L2 Cache, Dual Core 1.66 GHz, TDP of CPU 15W)

microETXexpress®-PV N450   36007-0000-16-0  
Intel® Atom™ N450 (512K Cache, 1.66 GHz, TDP of CPU 7W)

microETXexpress®-PV D410   36007-0000-16-1  
Intel® Atom™ D410 (512K Cache, 1.66 GHz, TDP of CPU 12W)

Details

Kontron – Basic 

ETXexpress®-PC

Highest Performance for COM Express™

- Up to Intel® Core™2 Duo with energy-saving 45nm
- New Intel® GS45 and ICH9M SFF
- DDR3 SO-DIMM up to 8 GB, dual channel
- 4 x Serial ATA with RAID, DirectX® 10
- 95 x 125 mm size

ETXexpress®-PC SP9300      38008-0000-23-2
ETXexpress®-PC SL9400:     38008-0000-19-2
ETXexpress®-PC SU9300:     38008-0000-12-2
ETXexpress®-PC PP T9400:  38009-0000-25-2
ETXexpress®-PC PP P8400: 38009-0000-23-2
ETXexpress®-PC PP 575:      38009-0000-20-0
ETXexpress®-PC PP T3100:  38009-0000-19-0
ETXexpress®-PC 722:            38008-0000-12-1

Details

ETXexpress-AI

- High performance COM with ECC and Robust Flexible Graphics
- Processor performance up to Intel® Core™ i7 SV (2.53GHz)
- Support for up to 8GB system memory (DDR3 with ECC support)
- Up to 2.6x graphics performance improvement 3D Mark06 over previous solutions

ETXexpress-AI i7 SV    38010-0000-25-2   Intel® Core™ i7 SV (2.53GHz, 4M L2)
ETXexpress-AI i5 SV    38010-0000-24-2   Intel® Core™ i5 SV (2.40GHz, 3M L2)
ETXexpress-AI i7 LV    38010-0000-20-2   Intel® Core™ i7 LV (2.0GHz, 4M L2)
ETXexpress-AI i7 ULV 38010-0000-11-2   Intel® Core™ i7 ULV (1.06GHz, 4M L2)

Details

ETXexpress®-SC

Quad Core Performance and USB 3.0 on COM Express®

- COM Express® basic Type 2 or Type 6 module
- 2 nd Generation Intel® Core™ i7 and Core™ i5 with QM67
- Up to 16 GB DDR3 with ECC support
- USB 3.0 and new DDI graphic interfaces


Details

Kontron - Starterkits and Evaluation Boards

Starterkits are complete care-free kits packaged in a single
case. They give you a head start: Starterkits include an
Evaluation Board which provides an easy plug-in of
COM Express™ modules and line-up many connectors and jacks.

Evaluation Boards minimize installation requirements and reduce
dramatically design time. They help to control and cut-back
pre-market costs. Evaluation boards are recommended for
testing in every design-in.

Details

Kontron – ETX® 

As technology evolves, the ETX standard has undergone further de­velopment in scalability and performance. In April 2006, Kontron and the members of the ETX Industrial Group released the latest genera­tion of the ETX specification, ETX 3.0.

ETX®-DC

Latest technology for ETX® 3.0

- Intel® Atom™ N270 processor in 45 nm with Hyperthreading
- Fanless use
- 2x SerialATA
- Up to 2 GB DDR2 memory

b-plus Baseboards


ePDAnano

Die ePDAnano Baseboards von b-plus nehmen die kreditkartengroßen nanoETXexpress® CPU-Module in dem von Kontron vorgestellten Formfaktor (COM Express™ konform) auf. Diese Module mit Intel® Atom™ low power CPUs bieten onboard RAM&Flash und Grafik. Das erlaubt den Einsatz von Windows® OS wie XP/XPe/CE oder Linux bei passiver Kühlung.

Details

b-plus SODIMM 200 Socket PC

Das CROSSBoard DX86 ist bis auf wenige Details mit der X-Board® Modulspezifikation passform- und funktionskompatibel. Das Kernstück bildet der Vortex86DX ein 27x27mm (581-Pin Ball BGA Package) großes SoC aus dem Hause DMP. Der Rechenkern verfügt über eine Floating Point Unit (FPU), ist ein x86 kompatibles Design und unterstützt Taktfrequenzen bis 1.0 GHz. Bei Taktungen bis 600 MHz ist ein vollständig passiv gekühlter Betrieb ohne Kühlkörper möglich, was einen äußerst geringen Bedarf an Bauraum zur Folge hat. Durch die sehr niedrige Leistungsaufnahme von maximal ca. einem bis zwei Watt und dem erweiterten Temperaturbereich ist das hier beschriebene System eine ideale Lösung für mobile Embedded Devices.